[PRNewswire] EOS demonstrates solutions for flexible, automated metal 3D

printing

-- At the formnext 2019, EOS is showcasing EOS Shared Modules as a production-ready solution. Consisting of various hardware and software modules, the solution simplifies and parallelizes the workflow both upstream and downstream of the build process. Especially when operating multiple 3D systems, EOS Shared Modules makes it possible to manufacture high-quality metal parts on an efficient, scalable, profitable basis. EOS Shared Modules is scheduled to be available by the second half of 2020.

(KRAILLING, Germany, Nov. 21, 2019 PRNewswire=연합뉴스) At the formnext 2019 in hall 11.1 booth D31, EOS is demonstrating its EOS Shared Modules periphery solution for integrated and efficient additive manufacturing (AM) with systems of the EOS M 400 series. The various modules plus transport systems and control center software enable users to implement the equipping, unpacking, transporting and sieving activities parallel to the AM build process. Both a manual and an automated EOS Shared Modules set-up are available for this purpose.

This modularity gives companies a maximum of flexibility to configure their production scenarios: The EOS Shared Modules components are not set up as a combined unit, but individually and thus are available for multiple 3D systems simultaneously. The EOSCONNECT ControlCenter software provides users with a continuous flow of key production parameters and seamless part traceability by means of a digital twin. The result is significantly increased efficiency, particularly in series manufacturing: EOS Shared Modules maximizes machine uptime, boosts productivity and therefore reduces part costs.

In future, the Shared Modules concept will also be offered for the EOS M 300 series.

As a further innovation in the field of industrial 3D , EOS is also displaying a range of trendsetting materials, including EOS ToolSteel H13, the only H13 tool steel that is suitable for additively manufacturing robust tools. Furthermore, EOS is presenting an array of copper materials that, on account of their varying conductivities, have a large number of possible applications, specifically in electronics.

Full Release available here [https://photos.prnasia.com/prnk/20191119/2647448-1 ].

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Source: EOS

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